Training / Service and Repair Centre
Saturday, 13 August 2011
Monday, 25 July 2011
Customize Casing by 3dfx™
Customization casing more like an engineering. The creativity, innovation, ideas and unique is keystone to make a perfect case. Seeking solution for every aspects before and after modify is not an easy task. It take wide personal experience, skills and imagination turns the blueprints into somewhat satisfaction work. In terms of how it looks, the design, features, scale, and built material give more advantage to it. But somehow, the lack of some features make them pointless.
Modification helps alot for some people. Whether to manage cable routing or putting additional stuff inside casing.
Here are some work we managed and done by us:
1. Cooler Master Cosmos 1000
- Cut holes for 24 pin
- Some holes 2 inch x 2 inch for cable routing
Laser Cutting:
Friday, 8 July 2011
Kursus Profesional Membaiki Komponen Laptop Motherboard
Adakah anda berminat mempelajari cara membaik pulih Laptop Motherboard? Atau jika anda punyai pengetahuan asas, anda mencari pengetahuan di tahap Intermediate dan Advance mengenainya? Kami dari 3dfx Technologies, menyediakan segala kelengkapan dan latihan peralatan membaiki Laptop motherboard.
Program ini meliputi pengenalan advance kurikulum bahagian elektronik yang bersamaan dua (2) tahun Kolej Diploma. Set lengkap modul termasuklah Current, Voltage, Resistance, Ohm's Law, Parallel and Series Circuits, Magnetism, AC/DC Circuits Capacitance, Inductance, Resonance, Filters, Transistors, Semiconductors, Amplifiers, Op Amps and Digital Electronics for repairing Laptop Motherboard.
Kursus Yang di Tawarkan:
Beginner
- Instructors 2
- Duration 2 days weekend, 6 hour per day = 12 hours
- Course fees RM 1200.00
- Class Size Maximum 4 Participants per Group
- Duration 2 days weekend, 6 hour per day = 12 hours
- Course fees RM 1200.00
- Class Size Maximum 4 Participants per Group
Matlamat:
A. Penggunaan Peralatan yang sesuai.
B. Kenalpasti komponen Laptop.
C. Membuka dan memasang semula Laptop.
D. Teknik servis luar dan dalam Laptop mengikut standard qualiti kilang (factory standar)
B. Kenalpasti komponen Laptop.
C. Membuka dan memasang semula Laptop.
D. Teknik servis luar dan dalam Laptop mengikut standard qualiti kilang (factory standar)
E. Asas komponen Laptop Troubleshooting.
F. Panduan tukar ganti LCD
G. Bios, Operating Software Installation & Drivers
F. Panduan tukar ganti LCD
G. Bios, Operating Software Installation & Drivers
Intermediate
- Instructors 2
- Duration 2 days weekend, 6 hour per day = 12 hours
- Course fees RM 5000.00
- Class Size Maximum 4 Participants per Group
- Duration 2 days weekend, 6 hour per day = 12 hours
- Course fees RM 5000.00
- Class Size Maximum 4 Participants per Group
Matlamat:
A. Penggunaan Peralatan yang sesuai.
B. Penggunaan Digital & Analogue Multi meter.
C. Kenalpasti Advance Component di Laptop Motherboard.
D. Asas SMD Component (surface mounted device) Troubleshooting.
E. Teknik Soldering menggunakan Temperature controlled soldering station.
F. Membaiki dan menanggal pasang SMD Component and IC Using SMD Rework Station.
B. Penggunaan Digital & Analogue Multi meter.
C. Kenalpasti Advance Component di Laptop Motherboard.
D. Asas SMD Component (surface mounted device) Troubleshooting.
E. Teknik Soldering menggunakan Temperature controlled soldering station.
F. Membaiki dan menanggal pasang SMD Component and IC Using SMD Rework Station.
Advance
- Instructors 2
- Duration 16 days, 6 hour per day = 96 hours
- Course fees RM 100.00 per Hour
- Class Size Maximum 4 Participants per Group
- Course fees RM 100.00 per Hour
- Class Size Maximum 4 Participants per Group
Matlamat:
A. Penggunaan Peralatan yang sesuai.
B. Menggunakan advance machine iaitu Advance Huntron Tracker kenalpasti komponen yang rosak.
C. Memahir penggunaan Ball Grid Array (BGA) Rework Station untuk Chip Removing, Replacing
D. Reballing pelbagai BGA Chip menerusi BGA chip Stencil
E. Membaiki PlayStation 3
F. Membaiki Microsoft XBOX 360
A. Penggunaan Peralatan yang sesuai.
B. Menggunakan advance machine iaitu Advance Huntron Tracker kenalpasti komponen yang rosak.
C. Memahir penggunaan Ball Grid Array (BGA) Rework Station untuk Chip Removing, Replacing
D. Reballing pelbagai BGA Chip menerusi BGA chip Stencil
E. Membaiki PlayStation 3
F. Membaiki Microsoft XBOX 360
Alatan, Dokumentasi Latihan dan Lain-lain:
Semasa latihan, pelajar akan menerima dokumentasi panduan berkenaan objektif latihan dan panduan membaik pulih.
- Mengenalpasti masalah power section motherboard
- Senarai data Power IC untuk pelbagai model Laptop
- Mengenalpasti panduan Surface Mounted Device (SMD)
- Panduan menggunakan Rework Station
Hasil Pembelajaran:
Prestasi memuaskan apabila
- Memahami penggunaan peralatan yang sesuai untuk membuka dan memasang semula Laptop
- Peserta boleh mengenalpasti komponen utama termasuk Laptop - Motherboard, Processor, RAM (Random Access Memory), Hard Disk, CD, DVD ROM Drive, dan Network Card Wireless.
- Peserta dapat mengenal pasti masalah biasa Laptop - Overheating Issue.
- Peserta boleh menggantikan Skrin LCD Laptop.
- Peserta mampu untuk memasang sistem operasi Windows dan installed supported driver.
Jadual kursus:
Kursus bermula dari jam 9.00 Pagi hingga 2.00 Petang.
Kursus di adakan setiap Sabtu dan Ahad.
Hari Jam
Sabtu 9 pagi - 2 petang
Ahad 9 pagi - 2 petang
Hidangan tengah hari di sediakan pihak penganjur.
Lokasi:
3dfx Technologies Sdn Bhd
43A, JLN SNUKER 13/28, TADISMA BUSINESS PARK,
SEKSYEN 13, 40100 SHAH ALAM, SELANGOR DARUL EHSAN
43A, JLN SNUKER 13/28, TADISMA BUSINESS PARK,
SEKSYEN 13, 40100 SHAH ALAM, SELANGOR DARUL EHSAN
Percuma:
- Multimeter di beri percuma kepada setiap peserta
- Panduan Khas lengkap di sediakan
Kemudahan yang di sediakan:
- Bilik Solat
- Cafe Makanan/Minuman
Kelayakan:
- Individu yang berminat!
- Syarikat-syarikat berasaskan IT Development
Hubungi:
- Faisal 017-637 9641
- Pejabat 03-5511 7277
- Fax 03-5511 3277
- Email faisal@3dfx.com.my
Thursday, 7 July 2011
Worklogs Lian Li X1000 Fatality
Proc: Intel i7
Motherboard: AsRock Fatality
Ram: 4GB Corsair
Graphic Card: Asus GTX 570 CU ii
PSU: Seasonic 750 watt Gold
Casing: Lian Li X1000
Objective:
- Decide powder coat suit to Fatality theme
- Sleeve casing cables / Fans
Casing before powder coat and sleeving:
Casing After Powder Coated:
Cables After Sleeving:
Board Layout:
Assemble Hardware:
Outcome:
Everything we had done together, satisfied us. Just share our contribution with forumer / blogger.
Enjoy!
Subscribe to:
Posts (Atom)